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Paper submission is now available until 31st of July through on-line.
We expect the great number of our colleagues’ participation in EDAPS2008 this year.
In order to submit your paper, please go to “Paper Submission” on the menu.
Then, click the “On line Submission” and follow the submission guide.
If you have not singed up yet, please sign up first for use.
Thank you for your cooperation in advance.
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Important dates
Key Deadlines:
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31-Jul-08
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: Print-ready 4-page Full Paper Submission (up to 4 pages) |
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30-Sep-08
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: Paper Acceptance Notification
Early Registration |
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31-Oct-08
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: Advanced Program Available on Website
Accommodation Reservation |
| Sponsor |
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The IEEE Components, Packaging and Manufacturing Technology Society (CPMT) |
| Technical Co-sponsor |
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The Korean Institute of Electromagnetic Enginering and Science(KIEES) |
| Corporate Sponsor |
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Korean Advanced Institute of Science and Tehnology |
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Ministry of Information and Communication |
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Korea Research Foundation |
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Ansoft Corporation |
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LeCroy Corporation |
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Cadence Design Systems |
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Sigrity, Inc. |
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Computer Simulation Technology |
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Agilent Technologies, Inc. |
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Tektronix, Inc. |
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POLLIWOG Corporation |
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Anritsu Corporation |
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Mentor Graphics |
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Rohde & Schwarz |
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EDAPS2008 Secretariat (Program, Paper & Exhibition) |
Department of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 373-1 Kuseong-dong, Yuseong-ku, Daejeon, 305-701, Korea |
| Tel:+82-42-869-5458 |
Fax:+82-42-869-8058 |
E-mail: |
edaps2008@ee.kaist.ac.kr |
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EDAPS2008 Secretariat (Registration & Hotel Reservation) |
Rm505 Taeyang Bldg. 44-2, Yoido-dong, Youngdeungpo-gu, Seoul,150-890, Korea
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| Tel:+82-(0)2-783-3473~4 |
Fax:+82-783-3475 |
E-mail: |
edaps2008@sejongconvention.com |
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